《化合物半导体加工中的表征(英文)》的主要内容包括： Preface to the Reissue of the Materials Characterization Series ix；Preface to Series x；Preface to the Reissue of Characterization of CompoundSemiconductor Processing xi；Preface xiii；Contributors xv等。

Preface to the Reissue of the Materials Characterization Series ix
Preface to Series x
Preface to the Reissue of Characterization of Compound
Semiconductor Processing xi
Preface xiii
Contributors xv
CHARACTERIZATION OF III—V THIN FILMS FOR
ELECTRONIC DEVICES
III—V COMPOUND SEMICONDUCTOR FILMS FOR
OPTICAL APPLICATIONS
CONTACTS
DIELECTRIC INSULATING LAYERS
OTHER COMPOUND SEMICONDUCTOR FILMS
DEEP LEVEL TRANSIENT SPECTROSCOPY： A CASE STUDY
ON GaAs
APPENDIX： TECHNIQUE SUMMARIES